This is a list of packages that we have done and can offer. Please read more about our capabilities at www.mak.se
We can assembly most kind of packages. But your product may require a new package or a substrate layout. In these cases there will be some design and lead time involved.
It is very important that we are able to verify material and processes ahead in time in order to achieve a successful hotlot run.
If a suitable package is available and the processes have been verified, hotlot.se can offer lead times as short as 6 hours.
Always
contact us and
check availability for you requirements.
| Molded PCB based QFN packages |
| 4x4 mm 28L QFN 5x5 mm 28L QFN 6x6 mm 40L QFN 7x7 mm 48L QFN 9x9 mm 56L QFN |
| BGA packages |
| SEMPAC packages |
| QUICKPAC packages |
| Kyocera NTK packages |
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